| PART |
Description |
Maker |
| 90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail
2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
| 0901200140 90120-0140 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0705419077-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419044-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705750081 |
2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .180 Pocket, Shrouded,with Press-fit Plastic Peg, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin
2.54mm (.100") Pitch SL垄芒 Header, Single Row, Right Angle, .180" Pocket, Shrouded,with Press-fit Plastic Peg, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective P
|
Molex Electronics Ltd.
|
| 0901210132-17 |
2.54mm Pitch C-Grid III Header, Single Row, Right Angle, 12 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 87937-0502 0879370502 |
2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
2.54mm (.100) Pitch KK垄莽 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50楼矛m (100楼矛") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
http://
Molex Electronics Ltd.
|
| 0901210128 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 8 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901210124 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 4 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901210131 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 11 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
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